Simplified processes compared to flip-chip inlay and converting

To be an effective manufacturer, our production facilities have to be rapid and robust. We employed high level of automation to integrate our production processes in a single, roll-to-roll production line, with multiple modules:

1. Antenna Printing
2. IC Strap Bonding
3. Printed Battery Bonding
4. Bond Curing
5. Lamination
6. Die Cut
7. Online QA

Owing to our simplification of processes with printed antenna and IC strap bonding, we are able to increase the production efficiency while remaining flexible to response to customer's customization demands. We do not need to make and stock "inlays" as the intermediate inventory for downstream "converting" process, and we do not need to change over for different combinations of ICs and antenna designs.